Abstract
This paper introduces the design process of ultrasonic transmitting and receiving device. The designed circuit of DC/DC high voltage power supply’s control chip is TL494, provide a voltage 260V DC. The transmitting and receiving circuits are based on the control of single chip computer, and generate high voltage pulsed by the theory of capacitor discharge. The wide-range dynamic echo signal is amplified by the circuit of logarithmic amplifier, and processed by the software resources on the PC. The experimental results show that the circuit completed works well and stable.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
De Sousa, A.V.G., De Albuquerque Pereira, W.C., Carlos Machado, J.: An Ultrasonic Theoretical and Experimental Approach to Determine Thickness and Wave Speed in Layered Media. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 54, 386–393 (2007)
Renaldas, R., Rymantas, K., Liudas, M.: Ultrasonic Thickness Measurement of Multilayered Aluminum Foam Precursor Material. IEEE Transactions on Instrumentation and Measurement 57, 2846–2855 (2008)
He, S., Liao, Q., Li, Y.: Design and Implementation of Front Circuit in Virtual Ultrasonic Nondestructive Flaw Detection System. Modem Electronic Technology 228, 116–119 (2009)
Zheng, H., Lin, S.: Ultrasonic Test. Press of China Social Security Publishing, Beijing (2008) (in Chinese)
Texas Instruments. TL494 Pulse-Width-Modulation Control Circuits (2005)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2011 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Feng, G., Sun, L. (2011). Design of Circuits for Transmitting and Receiving in Ultrasonic Transducers. In: Shen, G., Huang, X. (eds) Advanced Research on Computer Science and Information Engineering. CSIE 2011. Communications in Computer and Information Science, vol 153. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-21411-0_58
Download citation
DOI: https://doi.org/10.1007/978-3-642-21411-0_58
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-21410-3
Online ISBN: 978-3-642-21411-0
eBook Packages: Computer ScienceComputer Science (R0)