Microsystems and Nanotechnology

pp 287-352

MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining

  • Zhihong LiAffiliated withInstitute of Microelectronics, Peking University
  • , Bo LiuAffiliated withInstitute of Microelectronics, Peking University
  • , Wei WangAffiliated withInstitute of Microelectronics, Peking University

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The silicon-based micromachining technology, which is originated from the silicon IC (integrated circuits) technology, is the mainstream technology for MEMS fabrication, and the most MEMS products on market are manufactured with this technology. The silicon-based micromachining technologies can be divided into two categories: surface micromachining technology and bulk micromachining technology. Instead of introducing detailed individual techniques, this chapter will focus on utilizing and combining different processes to achieve different device fabrication and meet different requirements. For surface micromachining, isolation, metallization and monolithic integration are specially emphasized; while for bulk micromachining, we discuss more details on different sets of processes after a brief introduction of individual processes, such as DRIE and bonding.


Surface micromachining bulk micromachining DRIE bonding integration