Abstract
This packaging and interconnection technology for smart-power mechatronics is based on the flip-chip assembly of one system-chip microcontroller and several power semiconductors together with surface mounted devices on an insulated metal substrate. The particular features of this technology are the interconnect to the backside of a power die, the excellent thermal capability, and the reliability meeting automotive qualification targets. The electronic module forms an assembly unit with the actuator and provides the computational performance, diagnostics capability, and communication interface required for mechatronic nodes in a vehicle network.
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References
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Specks, J.W., Strecker, M. (2000). A Mechatronic Connector with Flip-Chip Microcontroller and Smart-Power Full-Bridge for DC Motor Control in Multiplex Networks. In: Krüger, S., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2000. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18146-7_6
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DOI: https://doi.org/10.1007/978-3-642-18146-7_6
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-62107-9
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