Abstract
Silicon on insulator (SOI)-based devices seem to be the best candidates for the ultimate integration of integrated circuits on silicon down to nm structures. An overview of the performance of nanoscale FETs, based on innovative concepts, technologies and device architectures, is addressed. The impact of alternative channel materials, source-drain contacts and multi-gates/channels on the performance and physical mechanisms in ultimate MOSFETs is highlighted. The interest of multi gate emerging and beyond-CMOS nanodevices for long term applications, based on nanowires or small slope switch structures for ultra low power applications is also presented. Finally, the flexibility of multi-gate and nanowire SOI structures for boosting the scalability and performance of DRAM, SRAM and flash memories is outlined.
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Acknowledgments
This work was partially supported by the European Network of Excellence NANOSIL (FP7) devoted to Silicon-based Nanodevices.
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Balestra, F. (2011). Silicon-based Devices and Materials for Nanoscale FETs. In: Nazarov, A., Colinge, JP., Balestra, F., Raskin, JP., Gamiz, F., Lysenko, V. (eds) Semiconductor-On-Insulator Materials for Nanoelectronics Applications. Engineering Materials. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-15868-1_6
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