Evaluation of Mechanical Properties

  • Mikio MuraokaEmail author
  • Hironori Tohmyoh
Part of the Engineering Materials book series (ENG.MAT.)


Mechanical properties such as elastic modulus, fracture stress, and yield stress of nano/micromaterials are fundamental data for practical design of nano/micromaterial-based devices. These properties generally differ from those of bulk material because of size effects. This chapter is devoted to an introduction of some techniques for evaluating the mechanical properties of nanowires and thin wires. In order to clarify the advantages of the techniques that we introduce, the first section gives an overview of typical techniques reported so far. In the subsequent sections, we take up atomic force acoustic microscopy using a concentrated-mass cantilever and a bending method based on the geometrically nonlinear problem on the bent shape, i.e., elastica, for evaluating elastic modulus and bending strength of brittle nanowires. Finally, evaluation of elastic–plastic properties of metallic thin wires is demonstrated by means of unsymmetrical, small-span bending test.


Atomic Force Microscopy Resonant Frequency Contact Stiffness Flexural Rigidity Atomic Force Microscopy Cantilever 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



M.Muraoka. acknowledges partial support from the Japan Society for the Promotion of Science (JSPS), through the Grant-in-Aid for Scientific Research (B) Grant No. 20360049 and Ms. Y. Ishigami and K. Kanazawa for their help in preparing the manuscript. H.Tohmyoh. acknowledges partial support from the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan under Grant-in-Aid for Young Scientists (A) Grant No. 21686012 and Dr. M.A.S. Akanda for his thankful discussion in preparing the manuscript.


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Authors and Affiliations

  1. 1.Department of Mechanical EngineeringAkita UniversityAkitaJapan
  2. 2.Department of NanomechanicsTohoku UniversitySendaiJapan

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