Abstract
In flip-chip packaging technology, the underfill encapsulation is one of the important processes to obtain a significant improvement in fatigue lifetime for the solder joints between IC chip and substrate. The advanced design of electronic devices aiming at the enhancement of the performance involves the increase of the number of solder bumps, smaller size of the IC chip and smaller gap height between IC chip and substrate. That leads to various problems caused by the flow behavior, such as voids in underfill and mis-placed IC chip. The numerical analysis is more and more strongly required for simulating the underfill flow behavior, including the condition of dispensing the underfill material on the substrate. In fact, it is desirable to predict the filling time, the final fillet shape formed around IC chip and the occurrence of air trap especially around the solder bump in the underfill process, considering the effect of contact angle, viscosity and surface tension of the underfill material for increasing the reliability of flip-chip packaging.
Keywords
- Contact Angle
- Solder Joint
- Solder Bump
- Rectangular Cylinder
- Spherical Liquid
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
This is a preview of subscription content, access via your institution.
Buying options
Tax calculation will be finalised at checkout
Purchases are for personal use only
Learn about institutional subscriptionsPreview
Unable to display preview. Download preview PDF.
References
J. U. Brackbill, D. B. Kothe, and C. Zemach. A continuum method for modeling surface tension. J. Comput. Phys., 100:335–354, 1992.
T. Hashimoto, K. Morinishi, and N. Satofuka. Parallel computation of multigrid method for overset grid. In ICCFD3, pages 167–174, 2002.
T. Hashimoto, K. Morinishi, and N. Satofuka. Parallel computation of vortex-induced vibration of a circular cylinder using overset grid. In Parallel Computational Fluid Dynamics, pages 403–410, 2003.
T. Hashimoto, K. Morinishi, and N. Satofuka. Numerical simulation for impact of elastic deformable body against rigid wall under fluid dynamic force. In ICCFD3, pages 375–380, 2004.
T. Hashimoto, K. Morinishi, and N. Satofuka. Numerical simulation of unsteady flow around deformable elastic body under fluid dynamic force. In ECCOMAS 2004, number 364, pages 1–19, 2004.
T. Hashimoto, S. Tanifuji, K. Morinishi, and N. Satofuka. Computers & fluids. Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging, 37(5):520–523, 2008.
S. E. Rogers and D. Kwak. Upwind differencing scheme for the time-accurate incompressible navier-stokes equations. AIAA Journal, 28:253–262, 1990.
M. Sussman, P. Smeraka, and S. Osher. A level set approach for computing solutions to incompressible two-phase flow. J. Comput. Phys., 114:146–159, 1994.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2010 Springer Berlin Heidelberg
About this paper
Cite this paper
Hashimoto, T., Saito, K., Morinishi, K., Satofuka, N. (2010). Computation of Two-phase Flow in Flip-chip Packaging Using Level Set Method. In: Tromeur-Dervout, D., Brenner, G., Emerson, D., Erhel, J. (eds) Parallel Computational Fluid Dynamics 2008. Lecture Notes in Computational Science and Engineering, vol 74. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-14438-7_15
Download citation
DOI: https://doi.org/10.1007/978-3-642-14438-7_15
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-14437-0
Online ISBN: 978-3-642-14438-7
eBook Packages: Mathematics and StatisticsMathematics and Statistics (R0)