Silicon Optical Interposers for High-Density Optical Interconnects

  • Yutaka Urino
  • Takahiro Nakamura
  • Yasuhiko Arakawa
Part of the Topics in Applied Physics book series (TAP, volume 122)


One of the most serious challenges in the information industry is bandwidth bottlenecks in inter-chip interconnects. We proposed a photonics–electronics convergence system in response to this issue, demonstrated silicon optical interposers integrated with all optical components on a silicon substrate, and achieved a high bandwidth density of 30 Tbps/cm2, which is sufficient for the needs of the late 2010s.


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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  • Yutaka Urino
    • 1
  • Takahiro Nakamura
    • 1
  • Yasuhiko Arakawa
    • 2
  1. 1.Photonics Electronics Technology Research Association (PETRA)TsukubaJapan
  2. 2.Institute for Nano Quantum Information Electronics (NanoQuine)The University of TokyoMeguro-KuJapan

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