Chapter

Silicon Photonics III

Volume 122 of the series Topics in Applied Physics pp 1-39

Date:

Silicon Optical Interposers for High-Density Optical Interconnects

  • Yutaka UrinoAffiliated withPhotonics Electronics Technology Research Association (PETRA) Email author 
  • , Takahiro NakamuraAffiliated withPhotonics Electronics Technology Research Association (PETRA)
  • , Yasuhiko ArakawaAffiliated withInstitute for Nano Quantum Information Electronics (NanoQuine), The University of Tokyo

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Abstract

One of the most serious challenges in the information industry is bandwidth bottlenecks in inter-chip interconnects. We proposed a photonics–electronics convergence system in response to this issue, demonstrated silicon optical interposers integrated with all optical components on a silicon substrate, and achieved a high bandwidth density of 30 Tbps/cm2, which is sufficient for the needs of the late 2010s.