Abstract
The automation of intrabay system in 300mm semiconductor wafer fabrication system is complex due to complicated product mixes, mass and dynamic transportation demands, transportation deadlock, and vehicle blockage. To obtain better overhead hoist transport (OHT) dispatching solution in intrabay system, a fuzzy logic based greedy dynamic priority dispatching policy is proposed. With experimental data from a 300mm semiconductor wafer fabrication system, it is demonstrated that the proposed approach has the better comprehensive performance than FEFS dispatching rule in aspect of cycle time, delivery time, transport time, movement, throughput, due date satisfaction, and WIP in intrabay system.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Similar content being viewed by others
References
Christopher, J., Kuhl, M.E., Hirschman, K.: Simulation analysis of dispatching rules for automated material handling systems and processing tools in semiconductor fabs. In: IEEE International Symposium on Semiconductor Manufacturing, pp. 84–87 (2005)
Kecman, V.: Learning and soft computing: support vector machines, neural networks, and fuzzy logic models. MIT Press, Cambridge (2001)
Kuo, C.H., Wang, C.H., Huang, K.W.: Behavior modeling and control of 300mm fab intrabays using distributed agent oriented Petri net. IEEE Transactions on systems, man, and cybernetics-Part A: systems and humans 33(5), 641–648 (2003)
Kuo, C.H., Huang, C.S.: Dispatching of overhead hoist vehicles in a fab intrabay using a multi-mission-oriented controller. International Journal of Advanced Manufacturing Technologies 27, 824–832 (2006)
Liao, D.Y., Wang, C.N.: Differentiated preemptive dispatching for automatic materials handling services in 300mm semiconductor foundry. International Journal of Advanced Manufacturing Technologies 29, 890–896 (2006)
Lin, J.T., Wang, F.K., Chang, Y.M.: A hybrid push/pull-dispatching rule for a photobay in a 300mm wafer fab. Robotics and Computer-Integrated Manufacturing 22, 47–55 (2006)
Lin, J.T., Wang, F.K., Yen, P.Y.: Simulation analysis of dispatching rules for an automated interbay material handing system in wafer fab. International Journal of Production Research 39(6), 1221–1238 (2001)
Liu, C.Y., Liao, D.Y.: An optimal OHT dispatching system for 300mm semiconductor manufacturing. In: IEEE International Conference on Systems, Man and Cybernetics, pp. 1631–1636 (2004)
Wang, C.N., Liao, D.Y.: Effective OHT dispatching for differentiated material handling services in 300mm wafer foundry. In: Proceedings of the 2003 IEEE International Conference on Robotics & Automation, Taipei, Taiwan, September, 14-19, pp. 1027–1032 (2003)
Uzsoy, R., Lee, C.Y., et al.: A Review of production planning and scheduling models in the semiconductor industry, Part I: System characteristics, performance evaluation and production planning. IIE Transactions 24(4), 47–60 (1992)
Uzsoy, R., Lee, C.Y., et al.: A review of production planning and scheduling models in the semiconductor industry, Part II: shop-floor control. IIE Transactions 26(5), 45–55 (1994)
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2010 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Wu, L., Zhang, J., Sun, Y., Zhang, G. (2010). A Greedy Dynamic Priority Dispatching Policy for Intrabay in Semiconductor Wafer Fabrication System. In: Huang, G.Q., Mak, K.L., Maropoulos, P.G. (eds) Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology. Advances in Intelligent and Soft Computing, vol 66. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-10430-5_72
Download citation
DOI: https://doi.org/10.1007/978-3-642-10430-5_72
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-10429-9
Online ISBN: 978-3-642-10430-5
eBook Packages: EngineeringEngineering (R0)