Advertisement

Two Approaches for the Design of Molded Interconnect Devices (3D-MID)

  • Christian Fischer
  • Jörg Franke
  • Klaus Feldmann
Part of the Advances in Intelligent and Soft Computing book series (AINSC, volume 66)

Abstract

To meet the challenges of designing mechatronic products, a program called MIDCAD was implemented which combines the functionality of Electronic Computer Aided Design (ECAD) and Mechanic CAD (MCAD) systems. Especially three-dimensional Molded Interconnect Devices (MID) and the layout of the electrical circuitry on their spatial surfaces are supported. In addition to MIDCAD there is a new research project working out the integration of macro-MID technology in automobiles (IMTP). On the one hand, the MCAD system CATIA V5 was enhanced by a computation of electrical properties of electric circuits and an automatic generation of the 3D electric conductor layout. The second part accomplishes the preparation of product information in CAD for automated production processes (CAM). This CAD-CAM-chain for a new technology called Flamecon® was developed in cooperation with LEONI AG, Germany. Furthermore, a technology database for MIDs was integrated plus a universal data format for geometry and extended information was implemented.

Keywords

Computer-Aided Design (CAD) Molded Interconnect Device (3D-MID) Computer-Aided Manufacturing (CAM) 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Diebold, K.: Effizienz in 3-D. Plastverarbeiter 6, 22–24 (2007)Google Scholar
  2. Franke, J.: Integrierte Entwicklung neuer Produkt- und Produktionstechnologien für raeumlich spritzgegossene Schaltungstraeger (3-D MID), dissertation, pp. 109–114. Carl Hanser Verlag, München (1995)Google Scholar
  3. Krebs, T., Franke, J.: Konstruktionswerkzeuge für elektronisch/mechanisch integrierte Produkte – ECAD- und MCAD-Funktionen in einem dreidimensionalen Entwicklungssystem integriert. Elektronik 18, 60–66 (2005)Google Scholar
  4. Kunze, A.: Automatisierte Montage von makromechatronischen Modulen zur flexiblen Integration in hybride Pkw-Bordnetzsysteme, dissertation, pp. 1–2, 23–30. Meisenbach Verlag, Bamberg (2008)Google Scholar
  5. Liess, H.D., Goerguelue, K.: Berechnung der Flamecon®-Schichten, working paper for research project IMTP, Universität der Bundeswehr, München, pp. 1–17 (2008)Google Scholar
  6. Mecadtron GmbH, System NEXTRA®, MECADTRON (2006), http://www.mecadtron.de/produkte/nextra.php.de (retrieved: 10.06.2009)
  7. Puhlmann-Hespen, C.: Flamecon stutzt den Kabelbaum im Auto. Markt&Technik (30), 1, 90 (2008)Google Scholar
  8. Uhl, K.: Pro/Engineer Wildfire 4. CAD CAM 1-2, 60–62 (2008)Google Scholar
  9. Zhuo, Y.: Entwurf eines rechnergestützten integrierten Systems für Konstruktion und Fertigungsplanung räumlicher spritzgegossener Schaltungsträger (3D-MID), dissertation, pp. 2–3,10–38. Meisenbach Verlag, Bamberg (2007)Google Scholar
  10. Zhuo, Y., Alvarez, C., Feldmann, K.: Horizontal and vertical integration of product data for the design of molded interconnect devices. In: Proceedings of the 4th International Conference on Digital Enterprise Technology, Bath, United Kingdom (2007)Google Scholar
  11. Zuken Inc., CR-5000 BoardModeler, ZUKEN (2009), http://www.zuken.com/products/cr-5000/analysis/parallel/boardmodeler.aspx (retrieved: 10.06.2009)

Copyright information

© Springer-Verlag Berlin Heidelberg 2010

Authors and Affiliations

  • Christian Fischer
    • 1
  • Jörg Franke
    • 1
  • Klaus Feldmann
    • 1
  1. 1.Institute for Manufacturing Automation and Production SystemsUniversity Erlangen-Nuremberg 

Personalised recommendations