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Cathode Sputtering

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Handbook of Thin-Film Technology

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Abstract

Cathode sputtering [1, 2] is more frequently used in thin film technology than evaporation. The reasons for this are the following:

- High melting material or dielectrics with a high frequency generator/source can be sputtered from a solid target.

- Sputtering is a ballistic process in which the target remains relatively cold. The composition of the released particle flux corresponds to the stoichiometry of the sputtering target.

- Sputtering with a reactive gas or a mixture of gases generates films of chemical compounds with a defined stoichiometry from elementary target material.

- The sputtering process can be used to deposit large areas with very high lateral homogeneity.

- By ion bombardment, the substrates can be cleaned before coating, and the properties of the sputtered film can be influenced, e.g. adhesion, strength, structure, etc.

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Authors
  1. Hartmut Frey Prof. Dr.
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Editors and Affiliations

  1. Esslingen, Germany

    Hartmut Frey Prof. Dr.

  2. Schwäbisch Gmünd, Germany

    Hamid R. Khan Prof. Dr.

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Frey, H. (2015). Cathode Sputtering. In: Frey, H., Khan, H.R. (eds) Handbook of Thin-Film Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-05430-3_6

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