Abstract
Sensor data fusion of active near infrared (NIR) and passive far infrared (FIR) for reliable detection of vulnerable road users in future warning automotive night vision systems requires for low-cost, mid-resolution FIR sensor arrays for hot spot detection. We present a new cost efficient technology for FIR arrays adopting a volume proven integrated MEMS process for the production of a suspended thermo-diode array. In contrast to established bolometer production all steps of the process developed are fully semiconductor compatible as the sensor element formation is an integral part of the read out IC processing and does not require ASIC backend processing with dedicated equipment. Vacuum wafer-level packaging compatibility further reduces cost. In a first step the proposed process has been verified with small integrated FIR arrays consisting of 42x28 pixels. The FIR array development reported is part of the EU FP7 project ‘ADOSE’.
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Reinhart, K., Eckardt, M., Herrmann, I., Feyh, A., Freund, F. (2009). Low-cost Approach for Far-Infrared Sensor Arrays for Hot-Spot Detection in Automotive Night Vision Systems. In: Meyer, G., Valldorf, J., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2009. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-00745-3_26
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DOI: https://doi.org/10.1007/978-3-642-00745-3_26
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