Real-Time Neural Networks Application of Micro-Electroforming for Different Geometry Forms

  • Sheau-Wen Shiah
  • Pai-Yu Chang
  • Tzeng-Yuan Heh
  • Po-Hung Lin
Conference paper
Part of the Lecture Notes in Computer Science book series (LNCS, volume 4953)


In this study, the approach of using neural networks is implemented for demonstrating its effectiveness in the real-time application of microelectroform on the different geometry forms. Three back-propagation neural networks are established via the training process with the numerical database to predict the distributions of Sh/Shmax, ACf/Cfmax and I/Imax. Comparisons of the predictions with the test target vectors indicate that the averaged root-meansquared errors from three back-propagation neural networks are well within 4.15 agent technology. Then, to fabricate the microstructure of higher surface accurate, higher hardness, lower residual stress and can be duplicated perfectly. Nevertheless, the instant knowledge of micro-electrforming characteristics is practically needed for many industrial agents technology applications.


Neural Networks Real-Time Micro-Electroforming 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Hertz, J., Krogh, A., Palmer, R.G.: Introduction to the Theory of Neural Computation. Addison-Wesley, New York (1991)Google Scholar
  2. 2.
    Demuth, H., Beale, M.: Neural Network Toolbox User’s Guidance. The Math Works Inc., Natick, Massachusetts (1993)Google Scholar
  3. 3.
    Yang, H., Kang, S.W.: Improvement of Thickness Uniformity in Nickel Electroforming for the LIGA Process. J. Machine Tools and Manufacture 40, 1065–1072 (2000)CrossRefGoogle Scholar
  4. 4.
    Zeller, R.L., Lsndau, U.: Electrochemically Active Surface Area. Voltammetric Charge Correlation for Ruthenium and Iridium Dioxide Electrodes. J. Electrochem. 138(4), 489–494 (2001)Google Scholar
  5. 5.
    Chan, K.C., Tan, H.J.: Numerical Analysis of an Inside-out Tube Inversion Process. J. of Materials Processing Technology 66, 130–136 (1997)CrossRefGoogle Scholar
  6. 6.
    Lee, S.L., Lee, Y.F., Chang, M.H., Lin, J.C.: Pulse Plating Effects During Ni-W Electrode position. Corrosion Prevention & Control, 71-76 (1999)Google Scholar
  7. 7.
    Yin, K.M., Jan, S.L., Lee, C.C.: Current Pulse with Reverse Plating of Nickel-Iron Alloys in a Sulphate Bath. Surface and Coatings Technology 88, 219–225 (1996)CrossRefGoogle Scholar
  8. 8.
    Andricacos, P.C., Tabib, J., Romankiw, L.T.: Stripping Voltammeter of Nickel-Iron Film Electrodeposited on Platinum Using a Rotating Ring-Disk Electrode. J. Electrochem. 135(5), 1172–1174 (1988)CrossRefGoogle Scholar
  9. 9.
    Yamasaki, T., Schlobmacher, P., Ehrlich, K., Ogino, Y.: Formation of Amorphous Electrodeposited Ni-W Alloys and Their Nanocrystallization. Nanostructured Materials 10(3), 375–388 (1998)CrossRefGoogle Scholar
  10. 10.
    Gould, R.D., Lopez, M.G.: Electrical Conductivity and Dynamics of Electroforming in Al-SiOx-Al Thin Film Sandwich Structure. Thin Solid Films 433, 315–320 (2003)CrossRefGoogle Scholar
  11. 11.
    Hessami, S., Tobias, C.W.: A Mathematical Model for Anomalous Co deposition of Nickel-Iron on a Rotating Disk Electrode. J. Electrochem. 136, 3611–3616 (1989)CrossRefGoogle Scholar
  12. 12.
    Pesco, A.M., Cheh, H.Y.: The Current Distribution within Plated Through-Holes: II. The Effect of Periodic Electrolysis. J. Electrochem. 136(2), 408–414 (1989)CrossRefGoogle Scholar
  13. 13.
    Kondo, K., Fukui, K., Uno, K., Shinohara, K.: Shape Evolution of Electrodeposited Copper Bumps. J. Electrochem. 143(6), 1880–1886 (1996)CrossRefGoogle Scholar
  14. 14.
    Georgiadou, M.: Modeling Current Density Distribution in Electrochemical Systems. Electrochemical Acta, 48 (2003) 4089-4095. Google Scholar
  15. 15.
    Duchanoy, C., Lapicque, F.: Current Distributions on Patterned Electrodes in Laminar Flow. Chemical Engineering Science 55, 1115–1126 (2000)CrossRefGoogle Scholar
  16. 16.
    Beck, U., Smith, D.T., Reiners, G., Dapkunas, S.J.: Mechanical Properties of SiO2 and Si3N4 Coatings: A BAM/NIST Co-Operative Project. Thin Solid Films 332, 164–171 (1998)CrossRefGoogle Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2008

Authors and Affiliations

  • Sheau-Wen Shiah
    • 1
  • Pai-Yu Chang
    • 2
  • Tzeng-Yuan Heh
    • 1
  • Po-Hung Lin
    • 1
  1. 1.Chung Cheng Institute of TechnologyNational Defense UniversityTahsiTaiwan 335. R.O.C.
  2. 2.Fortune Institute of TechnologyTaiwan 842. R.O.C.

Personalised recommendations