Abstract
In this paper a multichip module system for automotive applications is described. The MCM substrate is a IMS (Isolated Metal Substrate), which has been used for integration of analog signal processing stages, complex logic circuits and even power switching transistors. The main functionality of the door module implemented with this MCM, is the control of the power window motor with antipinch feature, although the prototype has been completed with communication (LIN-bus).
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References
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Federal Motor Vehicle Safety Standard 118, Power-Operated Window, Partition, and Roof Panel Systems
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© 2003 Springer-Verlag Berlin Heidelberg
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Ferré, A. et al. (2003). Autodoor. Microsystem for Automotiove Door Module. In: Valldorf, J., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2003. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-76988-0_32
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DOI: https://doi.org/10.1007/978-3-540-76988-0_32
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-00597-1
Online ISBN: 978-3-540-76988-0
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