Abstract
The demand for tire pressure monitoring systems is driven by increasing comfort and safety requirements. In order to make such systems available to a wide market, cost optimized solutions are necessary. Costs can be reduced by high integration, low power consumption, small size of the module and the reduction of components by monolithically integrated and intelligent on-chip algorithms.
To meet these requirements Infineon is developing highly integrated tire pressure sensor chips fabricated in a 0,5µm BiCMOS technology. The pressure sensor cells are realized in a surface micromachining process which allows the integration of complex electronic circuits as well as memory to store calibration data, configuration data and an identification number. A unique wake-up algorithm is implemented to eliminate the need for an additional wake-up switch or acceleration sensor.
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References
J. Becker; “Tire Pressure Monitoring Systems-the new MEMS based safety issue” Advanced Microsystems for Automotive Application 2002, Springer Verlag, ISBN 3-540-43232-9, pp 243–250.
M.L. Shaw; “Motion Sensing Techniques and Analysis for Direct Tire Pressure Monitoring” SAE-technical Paper 2003-01-0202, SAE2003 World Congress, Detroit Michigan.
R. Benedictm, P. Shepler, M. Fischer and D. Wagner; “Talking Tires — A Basis for Tire Diagnosis” SAE-technical Paper 2003-01-1279, SAE2003 World Congress, Detroit Michigan.
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© 2003 Springer-Verlag Berlin Heidelberg
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Bever, T., Kandler, M. (2003). Solutions for Tire Pressure Monitoring Systems. In: Valldorf, J., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2003. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-76988-0_21
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DOI: https://doi.org/10.1007/978-3-540-76988-0_21
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-00597-1
Online ISBN: 978-3-540-76988-0
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