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Influencia de la piezoelectricidad del colágeno tipo I en la adhesión celular

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Part of the IFMBE Proceedings book series (IFMBE,volume 18)

Abstract

Bone healing and growth are controlled by the rate of deposition of hydroxyapatite (HA). This process have been so far accredited to the work of osteoblasts, which are attracted by the electrical dipoles produced either by piezoelectricity, due to deformation of the bone, specially the collagen in it, or due to outside electrical stimuli. The main purpose of this work was to study the influence of the cortical bone collagen piezoelectricity effect, on the osteoblastic cells orientation. To evaluate the cellular adhesion on the cortical bone collagen subject to deformation, bone cells of newborn calvaria’s rats were extracted. The bone collagen was prepared and deformed following the specifications described in earlier studies. The results of this study shown that the piezoelectric phenomena of bone collagen promotes the cell’s adhesion on the compression side more than tension side compared with undeformed surface. Further studies ascertaining the osteoblastic activity due to the electric field are being advanced.

Palabras claves

  • hidroxiapatita
  • colágeno
  • osteoblastos
  • piezoelectricidad
  • tejido oseo

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Referencias

  1. Fukada E., Yasuda I. et al. (1957) On the piezoelectric effect of bone. J. Phys. Soc. Jpn 10: 1158–1162.

    CrossRef  Google Scholar 

  2. Silva C., Thomazini D. et al. (2001) Collagen-Hydroxyapatite films: piezoelectric films. Mat. Sci. Eng. 863: 210–218.

    Google Scholar 

  3. Knott L., Bailey A. (1998) Collagen cross-links in mineralization tissues: a review of their chemistry, function, and clinical relevance. Bone 22: 181–187

    CrossRef  Google Scholar 

  4. Young R. W., (1966) The control of cell specialization in bone. Clin Orthop. Relat. Res. 45: 153–156

    CrossRef  Google Scholar 

  5. Noris-Suárez K., Lira-Olivares J. et al (2007) In Vitro Deposition of Hydroxyapatite on Cortical Bone Collagen Stimulated by Deformation-Induced Piezoelectricity. 8(3): 941–948.

    Google Scholar 

  6. K. Noris-Suárez, I. Barrios de Arenas et al (2005) Caracterización biológica empleando células osteobláticas de vidrios del sistema SiO2.Na2O.CaO K2O.MgO.P2O5 modificados con Al2O3 y B2O3. Rev. Latin. Am. Met. Mat. 23: 82–88

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  7. Noris-Suárez K., Lira-Olivares J., Ferreira A. M., Graterol A., Feijoo J. L., Lee S. W.. (2007) Electrochemical influence of collagen piezoelectric effect in bone healing Mat. Sci. Forum 544–545: 981–984

    Google Scholar 

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© 2007 Springer-Verlag Berlin Heidelberg

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Ferreira, A.M., Suárez, K.N., Bello, A., Marquez, A.H., Feijoo, J.L., Lira-Olivares, J. (2007). Influencia de la piezoelectricidad del colágeno tipo I en la adhesión celular. In: Müller-Karger, C., Wong, S., La Cruz, A. (eds) IV Latin American Congress on Biomedical Engineering 2007, Bioengineering Solutions for Latin America Health. IFMBE Proceedings, vol 18. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-74471-9_153

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  • DOI: https://doi.org/10.1007/978-3-540-74471-9_153

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-74470-2

  • Online ISBN: 978-3-540-74471-9

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