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Novel Process Methodology of Smart Combi Card (SCC) Manufacturing for RFID/USN

  • JeongJin Kang
  • HongJun Yoo
  • SungRok Lee
Part of the Lecture Notes in Computer Science book series (LNCS, volume 4412)

Abstract

We propose a novel process for manufacturing smart combi card(SCC). The proposed process excludes a milling process for grinding a cavity and conductive adhesive which uses in a conventional process. Direct bonding including welding and soldering can be performed between an antenna coil and RF interface of a COB (Chip On Board) module. This brings the electrical connection to high reliability in order to hold RF functionality of a Smart combi card(SCC) with a terminal good. Hot melt sheet is employed between the COB module and the card body, and it is melt and stiffened through thermal lamination. This results in good adhesion between the COB module and the card body. Thus, the proposed process can provide the smart combi cards having good physical properties against repetitive bending and torsion stresses. The cards manufactured by the proposed process held their resonance frequencies for RF communication stable over 5,000 times of stresses. Therefore it can be applicable to the useful smart card for Radio Frequency Identification(RFID)/Ubiquitous Sensor Network(USN) environments.

Keywords

Smart combi card(SCC) RF card COB(Chip On Board) RFID/USN. 

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Copyright information

© Springer Berlin Heidelberg 2007

Authors and Affiliations

  • JeongJin Kang
    • 1
  • HongJun Yoo
    • 2
  • SungRok Lee
    • 3
  1. 1.Dong Seoul CollegeKorea
  2. 2.JT CorpKorea
  3. 3.Patent Attorney DK CHOI and PartnersKorea

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