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Improve the Shipping Performance of Build-to-Order (BTO) Product in Semiconductor Wafer Manufacturing

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Multi-Objective Programming and Goal Programming

Part of the book series: Advances in Soft Computing ((AINSC,volume 21))

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Abstract

The aim of this paper is to establish an application to review and control the shipping performance of build-to-order (BTO) product in semiconductor wafer manufacturing. The final goals are to avoid shortage of each order released from wafer bank to fulfill the finished goods requirement and minimize the overage quantity that will induce the high inventory. We apply the statistical method in wafer sort yield prediction via history data. Base on this, we can model

The overage and shortage quantity with the influential variables, namely order size, yield variability, uncertain demand and customer acceptance criterion. The model also allows estimating the expected overage as the review criterion between manufacturing unit and sales unit.

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© 2003 Springer-Verlag Berlin Heidelberg

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Hsu, SC., Peng, CY., Wu, CH. (2003). Improve the Shipping Performance of Build-to-Order (BTO) Product in Semiconductor Wafer Manufacturing. In: Multi-Objective Programming and Goal Programming. Advances in Soft Computing, vol 21. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-36510-5_49

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  • DOI: https://doi.org/10.1007/978-3-540-36510-5_49

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-00653-4

  • Online ISBN: 978-3-540-36510-5

  • eBook Packages: Springer Book Archive

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