Abstract
Deep sub-micron effects influence the signal transmission especially on global wires. In order to select communication architectures, minimize power dissipation and improve signal integrity it is necessary to explore DSM effects already at high levels of design abstraction. Therefore in this paper we present a parameterized high-level simulation model which is based on SPICE simulations and evaluates therefore signal integrity and power dissipation very accurately. The maximum error of our model was 1.3%. In comparism to a full SPICE simulation the required computation time could be reduced by a factor of up to 900.
This work is funded by the German Science Foundation DFG within the joint project VIVA under MU 1024/5-3.
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Kretzschmar, C., Bitterlich, T., Müller, D. (2004). A High-Level DSM Bus Model for Accurate Exploration of Transmission Behaviour and Power Estimation of Global System Buses. In: Macii, E., Paliouras, V., Koufopavlou, O. (eds) Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation. PATMOS 2004. Lecture Notes in Computer Science, vol 3254. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-30205-6_11
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DOI: https://doi.org/10.1007/978-3-540-30205-6_11
Publisher Name: Springer, Berlin, Heidelberg
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