Abstract
Autonomous Driving at level 5 requires high-performance vehicle computers (HPVC) to perform the multitude of complex functions, such as comprehensive vision processing, object recognition, intelligent traffic system, and task dispatch between different ECUs in the car. Today, HPVC systems are available as development platforms but not ready to be deployed under harsh operating conditions of real vehicles yet. The paper assesses the requirements, discusses the current state of the art, and introduces architectural and design solutions for a robust and safe automotive grade HPVC platform. The required high computational power and all the necessary communication interfaces will be provided at costs allowing the production of passenger cars for the broad public.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Notes
- 1.
The expression goes back to the canary birds used in old days' coalmines.
References
Nvidia—Drive PX Xavier … Pegasus. https://www.nvidia.de/self-driving-cars/drive-px/
Bret, C.L.: Power electronics for EV/HEV—market, innovations and trends, Yole Development report (2016)
Michel, B.: Roadmap towards efficiency—zero-emission datacenters; IBM-Research, Advanced Thermal Packaging/Micro Integration 02 June 2015. https://www.zurich.ibm.com/st/energy_efficiency/zeroemission.html
Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Leblebici, Y., Wunderle, B., Reichl, H.: Heat-removal performance scaling of interlayer cooled chip stacks. In: Proceedings of 12th Itherm Conference, Las Vegas, USA, 2–5 June 2010
Madhour, Y., Zervas, M., Schlottig, G., Brunschwiler, T., Leblebici, Y., Thome, J.R., Michel, B.: Integration of intra chip stack fluidic cooling using thin-layer solder bonding. In: Proceedings on 3DIC Conference, San Francisco, CA, USA, 2–4 October 2013
Tiwei, T., Oprins, H., Cherman, V., Van der Plas, G., De Wolf, I., Beyne, E., Baelmans, M.: High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler. In: Proceedings on IEDM Conference 2013
Buller, W.T.: Benchmarking sensors for vehicle computer vision systems. Michigan Tech Research Institute, Ann Arbor, MI (2017). http://mtri.org/automotivebenchmark.html
Gupta, M.P., Kumar, S.: Thermal Management of many-core processors using power multiplexing. Electronics Cooling (2013)
Wunderle, B., May, D., Abo Ras, M., Keller, J.: Non-destructive in-situ monitoring of delamination of buried interfaces by a thermal pixel (Thixel) chip. In: Proceedings on 16th Itherm Conference, Orlando, USA, May 30–June 2 2017
Hager, M., Lock, A.: Future electrical architectures and their effects on automotive ECU and connector systems (Zukünftige Bordnetzarchitekturen und deren Auswirkungen auf automotive Steuergeräte und Steckerssysteme). In: 6th International Congress on Automotive Wire Harness, Ludwigsburg, 13–14 March 2018
Rzepka, S., Gromala, P.J.: Integrated smart features assure the high functional safety of the electronics systems as required for fully automated vehicles. In: Advanced Microsystems for Automotive Applications. Lecture Notes in Mobility, pp. 167–178. Springer, Cham (2017). https://doi.org/10.1007/978-3-319-66972-4_14
Schindler-Saefkow, F., Rost, F., Otto, A., Faust, W., Wunderle, B., Michel, B., Rzepka, S.: Stress chip measurements of the internal package stress for process characterization and health monitoring. In: 13th International Conference on EuroSimE 2012, Proceedings, Art. No. 6191746
Acknowledgement
The authors would like to thank Stefania Fontanella, Hubert Straub, and Abdessamad El Ouardi (Robert Bosch GmbH) for their valuable input. We are looking forward to the work in ‘HiPer’, the PENTA project supported by BMBF/VDI (Germany), RVO (Netherlands), and VLAIO (Belgium).
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2019 Springer Nature Switzerland AG
About this paper
Cite this paper
Hager, M., Gromala, P., Wunderle, B., Rzepka, S. (2019). Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving. In: Dubbert, J., Müller, B., Meyer, G. (eds) Advanced Microsystems for Automotive Applications 2018. AMAA 2018. Lecture Notes in Mobility. Springer, Cham. https://doi.org/10.1007/978-3-319-99762-9_5
Download citation
DOI: https://doi.org/10.1007/978-3-319-99762-9_5
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-99761-2
Online ISBN: 978-3-319-99762-9
eBook Packages: EngineeringEngineering (R0)