Abstract
The use of advanced Information and Communications Technology (ICT) is becoming really important in teaching-learning activities. This is especially relevant within the field of engineering where many teachers are beginning to use sophisticated virtual laboratories (VL) and computer applications in the classroom. Indeed, results of many teaching experiences validate the usefulness of such virtual tools due to their high efficiency in the teaching-learning process. However, some of the ICT tools and applications used in engineering education are becoming excessively complex and require extensive training to use them, which may be even more difficult than the knowledge they wish to teach. This communication deals with the development of new teaching technologies used in Materials Science and Engineering, specifically a VL based on the step-by-step performance of a Rockwell hardness testing machine. To achieve this goal, a realistic 3D scenario based on non-immersive virtual reality design −similar to the usual videogame environments − is used to increase students’ motivation regarding the study of hardness testing of metals. Like any virtual tool which begins to be used, some changes or potential areas of improvement will arise when applied in the classroom during the subsequent years. Any improvement should take into account students’ opinions and also consider that a virtual tool must be implemented within an appropriate teaching methodology with an educational aim.
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Acknowledgments
This work has been supported by project “IOTEC: Development of Technological Capacities around the Industrial Application of Internet of Things (IoT)”. 0123_IOTEC_3_E. Project financed with FEDER funds, Interreg Spain-Portugal (PocTep).
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Rubio, M.P., Vergara, D., Rodríguez, S., Extremera, J. (2019). Virtual Reality Learning Environments in Materials Engineering: Rockwell Hardness Test. In: Di Mascio, T., et al. Methodologies and Intelligent Systems for Technology Enhanced Learning, 8th International Conference. MIS4TEL 2018. Advances in Intelligent Systems and Computing, vol 804. Springer, Cham. https://doi.org/10.1007/978-3-319-98872-6_13
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