Abstract
Modelling technologies are playing a key role in supporting new developments in nano-packaging for electronic systems. This chapter provides an overview of these technologies from continuum modelling using techniques such as finite elements, atomistic models based on molecular dynamics and optimisation under uncertainty, as well as homogenisation methods that link results across the length and timescales. Challenges for these techniques in terms of modelling nano-packaging applications are also discussed.
The chapter then goes onto providing a review of these technologies for key design stages in and electronic system such as fabrication, assembly and its performance/reliability. Examples include focused ion beam milling, nanoimprint lithography, electroforming, 3D printing and additive manufacturing, solder paste printing, microwave curing of polymers, impact of underfills on solder joint reliability, thermos-mechanical behaviour of conductive adhesives and performance thermal interface materials. These examples provide the reader with an overview of how these modelling technologies can be applied to real-world nano-packaging applications.
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Acknowledgements
The authors would like to acknowledge the financial support from the Engineering and Physical Sciences Research Council (EPSRC) that has supported some of the modelling development work at Greenwich as detailed in the illustrations above. We also acknowledge the 3D integration consortium (supported under ESPRC fund EP/C534212/) and the EU-funded programme NextFactory (http://www.nextfactory-project.eu, under grant agreement No. 608985) and the Centre for Power Electronics (funded by EPSRC under grant number EP/K034804/1).
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Bailey, C., Stoyanov, S., Lu, H., Tilford, T., Yin, C., Strusevich, N. (2018). Modelling Technologies and Applications. In: Morris, J. (eds) Nanopackaging. Springer, Cham. https://doi.org/10.1007/978-3-319-90362-0_2
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