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Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging

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Nanopackaging

Abstract

In modern microelectronics production, additive fabrication processes offer a thematic contrast to traditional micro-fabrication processes that rely critically on subtractive patterning. Printing, a bottom-up process, plays an important role in this production, especially when nanomaterials are printed. There are many areas in which such printing is used [1], but only electrically conductive structures in electronic packaging are the object of interest in this section.

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  1. Wroclaw University of Sciences and Technology, Wroclaw, Poland

    Jan Felba

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  1. Department of Electrical and Computer Engineering, Portland State University, Portland, OR, USA

    James E. Morris

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Felba, J. (2018). Silver Nanoparticles for Inkjet-Printed Conductive Structures in Electronic Packaging. In: Morris, J. (eds) Nanopackaging. Springer, Cham. https://doi.org/10.1007/978-3-319-90362-0_14

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