Abstract
As explained in the previous section, transfer packaging is one of interesting MEMS packaging technologies because it doesn’t have process compatibility issues with main MEMS process. Thus, the different transfer techniques will be thoroughly explained in the following
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Seok, S. (2018). Microcap (or Microstructure) Transfer Techniques. In: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering. Springer Series in Advanced Manufacturing. Springer, Cham. https://doi.org/10.1007/978-3-319-77872-3_2
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DOI: https://doi.org/10.1007/978-3-319-77872-3_2
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