Advertisement

Pathfinding and Co-design

  • Farhang YazdaniEmail author
Chapter
  • 455 Downloads

Abstract

In this chapter, we will learn about die-package-board pathfinding and co-design. We will also learn about basics of device floorplanning and co-design. A number of industry-based examples are provided to demonstrate the integration process. Co-design and pathfinding methodologies presented in this chapter build the foundation of 2.5D/3D heterogeneous integration.

Keywords

Silicon interposer 2.5D/3D Heterogeneous Integration Interconnect Packaging PCB System design Pathfinding Methodology Optimization Wide I/O HBM Partition Logic Memory I/O buffer cell Flip chip Die System in package SIP BGA MCM 3D IC Device Substrate Mixed-signals 

References

  1. 1.
    Yazdani F, Park J (2014) Pathfinding and design optimization of 2.5D/3D devices in the context of multiple PCBs. In: IMAPS 10th international conference on device packaging, Fountain Hills, AZ, USA, pp 294–297, 10–13 Mar 2014Google Scholar
  2. 2.
    Yazdani F, Park J (2014) Pathfinding methodology for optimal design and integration of 2.5D/3D interconnects. In: Proceedings of the 64th IEEE electronic components and technology conference, Orlando, Florida, 26–30 May 2014Google Scholar

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.BroadPak CorporationSan JoseUSA

Personalised recommendations