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Flip Chip Physical Implementation

  • Farhang YazdaniEmail author
Chapter
  • 476 Downloads

Abstract

In this chapter, we will learn the basics of flip chip packaging, including bump pattern selection, design, and assembly process. Flip chip rules and guidelines provided in this chapter are necessary for design of common flip chip packages as well as advanced packages. Reader is encouraged to master the flip chip design strategy and rules provided in this chapter.

Keywords

Flip chip Package Substrate Design Signal Power Integrity Bump pattern Copper pillar Solder ball BGA pattern Via Build up via Routing Impedance LVDS Differential Core Underfill Mold Die Bump pitch Micro-ball Surface finish ENIG ENEPIG IT OSP SOP Mask SIP System Assembly 

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.BroadPak CorporationSan JoseUSA

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