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In this chapter we will first learn about the background, roadmaps and motivation for advanced packaging and heterogeneous integration followed by introduction to basics of semiconductor packaging.
KeywordsModular integration Heterogeneous integration Package design 2.5/3D design IP chiplet Logic SOC Routing Optimization Methodology Connectivity Substrate I/O cell placement Floor plan System Logic partitioning Die Wafer stacking Active layer bonding TSV Machine learning Deep learning Artificial intelligence AI
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- 2.Yazdani F, Park J (2014) Pathfinding methodology for optimal design and integration of 2.5D/3D interconnects. In: Proceedings of the 64th IEEE electronic components and technology conference, Orlando, Florida, 26–30 May 2014Google Scholar
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