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Introduction

  • Farhang YazdaniEmail author
Chapter
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Abstract

In this chapter we will first learn about the background, roadmaps and motivation for advanced packaging and heterogeneous integration followed by introduction to basics of semiconductor packaging.

Keywords

Modular integration Heterogeneous integration Package design 2.5/3D design IP chiplet Logic SOC Routing Optimization Methodology Connectivity Substrate I/O cell placement Floor plan System Logic partitioning Die Wafer stacking Active layer bonding TSV Machine learning Deep learning Artificial intelligence AI 

References

  1. 1.
    Yazdani F, Park J (2014) Pathfinding and design optimization of 2.5D/3D devices in the context of multiple PCBs. In: IMAPS 10th international conference on device packaging, Fountain Hills, AZ, USA, 10–13 Mar 2014, pp 294–297Google Scholar
  2. 2.
    Yazdani F, Park J (2014) Pathfinding methodology for optimal design and integration of 2.5D/3D interconnects. In: Proceedings of the 64th IEEE electronic components and technology conference, Orlando, Florida, 26–30 May 2014Google Scholar

Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.BroadPak CorporationSan JoseUSA

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