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Characteristics of Solder Paste and Reflow Process Analysis

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Advances in Intelligent Systems and Interactive Applications (IISA 2017)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 686))

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Abstract

No matter what the welding technology, should ensure that meet the basic requirements of welding, welding to ensure good results. High quality welding should have the following 5 basic requirements: 1. appropriate heat; 2. good wetting; 3. appropriate solder joint size and shape; 4. controlled tin flow direction in the welding process; 5. the welding surface does not move to have enough solder joint life, we must ensure that the shape and size of solder joint with welding end structure. The mechanical strength of the solder joint is too small, unable to withstand the stress in use, even after the welding stress is unable to bear. But once in use began to appear fatigue or creep cracking, the fracture speed is rapid. The shape of the solder joints will cause bad homes from the phenomenon of light, life expectancy shortened the solder joint.

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Correspondence to Junjie Lv .

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Lv, J., Li, X. (2018). Characteristics of Solder Paste and Reflow Process Analysis. In: Xhafa, F., Patnaik, S., Zomaya, A. (eds) Advances in Intelligent Systems and Interactive Applications. IISA 2017. Advances in Intelligent Systems and Computing, vol 686. Springer, Cham. https://doi.org/10.1007/978-3-319-69096-4_119

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  • DOI: https://doi.org/10.1007/978-3-319-69096-4_119

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-69095-7

  • Online ISBN: 978-3-319-69096-4

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