Abstract
Seamless integration of embedded multifunctional electronics with host materials could transfer inactive materials into active systems, which allow the communication between the materials and external environment, and create a smart system [1, 2]. Traditional electronics are planar and rigid, however, most materials and systems in our daily life are three-dimensional (3D) and non-planar.
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Liu, J. (2018). Integration of Three-Dimensional Macroporous Nanoelectronics with Materials. In: Biomimetics Through Nanoelectronics. Springer Theses. Springer, Cham. https://doi.org/10.1007/978-3-319-68609-7_3
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DOI: https://doi.org/10.1007/978-3-319-68609-7_3
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