CMOS Multimodal Sensor Array for Biomedical Sensing



Multimodal sensor arrays with potentiometric, amperometric, impedimetric, and photometric sensors have been designed and fabricated by standard CMOS process and post-CMOS process to form gold electrodes and microfluidics. Three types of sensor arrays, 64 × 64 potentiometric and photometric sensor array, 64 × 64 ASSP (application-specific standard product) sensor array, and 512 × 512 high-density sensor array, are implemented in 7 × 7.5 mm2 chip and total power consumption 10 mW using 0.6 μm CMOS technology. In potentiometric and photometric sensor array, electric potential is sensed and outputted as an analog signal by a cascode source-drain follower, and photocurrent is converted to digital signal by current-mode ADC (analog-to-digital converter). In ASSP sensor array, potentiometric, amperometric, impedimetric, and photometric sensors output electric currents which are processed by current mixers and current-mode ADCs in array peripheral circuits. In high-density sensor array, submicron gold electrodes are formed by electroless plating. These sensors are applied to enzyme sensor with redox mediator and counting bacteria/viruses one by one. Stand-alone portable diagnostic inspection system is constructed with 18 × 10 × 5.5 cm3 and 850 g. Power is 5 V 220 mA supplied from USB adapter.


Complementary Metal Oxide Semiconductor (CMOS) High-density Sensor Arrays Standard CMOS Process Application-specific Standard Product (ASSP) Photometric Sensor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



This research is financially supported by a Grant-in-Aid for Scientific Research (No. 25220906, 20226009) from the Ministry of Education, Culture, Sports, Science and Technology of Japan and by Adaptable and Seamless Technology Transfer Program through Target-Driven R&D (No. AS272S001b) from the Japan Science and Technology Agency, Japan.


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Copyright information

© Springer International Publishing AG 2018

Authors and Affiliations

  1. 1.Department of Electronic EngineeringGraduate School of Engineering, Nagoya UniversityNagoyaJapan

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