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Free-Surface Dynamics in Induction Processing Applications

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Abstract

Induction processing technology is widely applied in the metallurgical and crystal growth industry where conducting or semi-conducting material is involved. In many applications, alternating magnetic fields, which are used to generate heat and force, occur together with a free-surface flow. The numerical analysis of such three-dimensional, multi-physical phenomena on the industrial scale is still a big challenge. We present an overview of a novel multi-mesh model for addressing these kinds of coupled problems by means of computational simulations. It is based on the Finite Volume Method (FVM) of the software foam-extend (http://www.foam-extend.org)—an extended version of OpenFOAM\(^{\textregistered }\) (Weller et al. in Computational Physics 12(6):620–631, 1998, [15]). Our development is motivated by the desire to investigate the so-called Ribbon Growth on Substrate (RGS) process. RGS is a crystallisation technique that allows for the production of silicon wafers and advanced metal silicide alloys Schönecker et al. (Solid State Phenomena 95-96:149-158 2004, [12]) with high volume manufacturing and outstanding material yield.

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Acknowledgements

Financial support for this research from the German Helmholtz Association in frame of the Alliance Liquid Metal Technologies (LIMTECH) is gratefully acknowledged. We also would like to thank all the teachers and students involved in the NUMAP-FOAM Summer School 2015 at the Faculty of Mechanical Engineering and Naval Architecture (FAMENA) in Zagreb for numerous fruitful discussions, shared code and helpful comments.

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Correspondence to Pascal Beckstein .

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Beckstein, P., Galindo, V., Gerbeth, G. (2019). Free-Surface Dynamics in Induction Processing Applications. In: Nóbrega, J., Jasak, H. (eds) OpenFOAM® . Springer, Cham. https://doi.org/10.1007/978-3-319-60846-4_15

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  • DOI: https://doi.org/10.1007/978-3-319-60846-4_15

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-60845-7

  • Online ISBN: 978-3-319-60846-4

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