Abstract
This chapter is focused on the Design eco-system for realizing competitive high volume 2.5D and 3D SiP products. The die-to-die interactions precipitated by 2.5D and 3D SiP integration are highlighted, with emphases on modeling and proactive management of the Thermal and Mechanical Stress interactions. The gaps between the design methodology required for 2.5D and 3D SiPs and the current state of the art are outlined, and the possible practical shortcut solutions are proposed. The infrastructure requirements for technology characterization, including the idiosyncrasies of 2.5D and 3D Test Chip design and evaluation, as well as the special modeling needs for More-than-Moore technologies are also outlined.
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Radojcic, R. (2017). More-than-Moore Design Eco-System. In: More-than-Moore 2.5D and 3D SiP Integration. Springer, Cham. https://doi.org/10.1007/978-3-319-52548-8_4
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DOI: https://doi.org/10.1007/978-3-319-52548-8_4
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