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Digital Stress Imaging in Mesoscale Microstructure Dependent Deformation Visualized Using Nano-mechanical Raman Spectroscopy: Role of Initial Manufacturing Originated Residual Stresses

  • Yang Zhang
  • Vikas TomarEmail author
Conference paper
Part of the The Minerals, Metals & Materials Series book series (MMMS)

Abstract

This research focuses on work with emphasis on direct measurements of stresses during mesoscale microstructural deformation of nickel based and zirconium based alloys during 3-point bending tests for fracture toughness at elevated temperatures. A novel nano-mechanical Raman spectroscopy measurement platform was designed for temperature, stress, and chemistry mapping at micro to nanoscale for different temperature and loading conditions. During the 3-point bending test to measure fracture toughness of micron sized samples, notch tip plastic stresses as a function of microstructure, load, and temperature, with micron scale resolution were measured. The temperature field distribution was correlated to stress distribution and residual microstructure stresses around the area of the notch tip. The mechanical properties which include the elastic modulus, hardness and stress-strain relation at the plastic zone around the notch tip were also measured and compared before and after the bending tests. A new finite element method formulation that incorporated different elastic and plastic material properties from indentation experiments at different locations was validated using the experiments. We find that residual stress is an important indicator of scatter in material failure data.

Keywords

Nano-mechanical Raman Raman spectroscopy Stress distribution Temperature field Nanoindentation 

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Copyright information

© The Minerals, Metals & Materials Society 2017

Authors and Affiliations

  1. 1.School of Aeronautics and AstronauticsPurdue UniversityWest LafayetteUSA

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