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Work-in-Progress: MicroElectronics Cloud Alliance

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Interactive Collaborative Learning (ICL 2016)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 545))

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Abstract

Neither university can afford the necessary infrastructure, clean rooms, technology and experts in all fields of this multidisciplinary science. Sharing of laboratory experiences, CAD tools, project ideas, and a common infrastructure represents a sort of “educational cloud” on top of the cloud software/hardware infrastructure.

8 European HEIs and 8 enterprises are developing e-learning materials for 21 courses on: CAD systems, microelectronics technologies, test, characterisation and application of integrated circuits and systems, and we will provide them as open educational resources to strengthen the virtual mobility. Each university will provide remote access to its facilities, laboratory experiments or software systems for the partners in a cloud teaching system, giving them access to new resources. The common ones can be optimized, reducing the singular cost per institute and increasing the available computational and structural power.

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Acknowledgement

This project has been funded with support from the European Commission. This publication reflects the views only of the author, and the Commission cannot be held responsible for any use which may be made of the information contained therein.

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Correspondence to Slavka Tzanova .

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Tzanova, S., Demarchi, D. (2017). Work-in-Progress: MicroElectronics Cloud Alliance. In: Auer, M., Guralnick, D., Uhomoibhi, J. (eds) Interactive Collaborative Learning. ICL 2016. Advances in Intelligent Systems and Computing, vol 545. Springer, Cham. https://doi.org/10.1007/978-3-319-50340-0_30

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  • DOI: https://doi.org/10.1007/978-3-319-50340-0_30

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-50339-4

  • Online ISBN: 978-3-319-50340-0

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