Thick Films

Abstract

Thick film technology is an example of one of the earliest forms of microelectronics-enabling technologies and it has its origins in the 1950s. At that time it offered an alternative approach to printed circuit board technology and the ability to produce miniature, integrated, robust circuits. It has largely lived in the shadow of silicon technology since the 1960s. The films are deposited by screen printing (stenciling), a graphic reproduction technique that can be dated back to the great Chinese dynasties of around a thousand years ago. Indeed, there is evidence that even early Palaeolithic cave paintings from circa 15000 BC may have been created using primitive stenciling techniques. With the advent of surface-mounted electronic devices in the 1980s, thick film technology again became popular because it allowed the fabrication of circuits without through-hole components.

This chapter will review the main stages of the thick film fabrication process and discuss some of the commonly used materials and substrates. It will highlight the way in which the technology can be used to manufacture hybrid microelectronic circuits. The latter stages of the chapter will demonstrate how the technology has evolved over the past twenty years or so to become an important method in the production of solid state sensors.