REWAS 2013 pp 122-132 | Cite as

Preparation and Characterization of Fibrous Copper Powder used for Conductive Filler

  • Youqi Fan
  • Yongxiang Yang
  • Yanping Xiao
  • Zhuo Zhao


A novel two-stage process is investigated for preparing the fibrous copper powder used for conductive filler in conductive paste. Based on thermodynamic simulation of Cu(II) — C2O42- -NH3 — NH4+ — H2O system, the rod-shape copper oxalate salt is synthesized firstly with coordination precipitation method, using ammonium oxalate and a purified copper salt solution which could be from either primary or secondary copper-bearing resources. According to the results of XRD, element analysis and X-ray single crystal diffraction, it can be inferred that the composition of the copper oxalate salt is [Cu(NH3)3]C2O4 • xH2O, and the NH3 plays a significant role in the formation of rod-shape crystal. Secondly, the copper oxalate salt is decomposed to fibrous copper powder at 350°C in inert atmosphere. The thermo-decomposition procedure is characterized by TG-DSC-FTIR, XRD and SEM. It is found that the phase of copper oxalate salt transforms as following: [Cu(NH3)3]C2O4 • xH2O→ [Cu(NH3)3]C2O4→ CuC2O4→Cu.


Fibrous copper powder Thermodynamic analysis Coordination precipitation Thermal decomposition Conductive Filler 


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  1. [1]
    Boudenne. Handbook of Multiphase Polymer Systems[M]. John Wiley and Sons, 2011: 427–431Google Scholar
  2. [2]
    H. Koshikawa, H. Usui, Y. Maekawa. Thermally stable and anisotropically conducting membranes consisting of sub-micron copper wires in polyimide ion track membranes [J]. Journal of Membrane Science, 2009, 327(1–2): 182–187CrossRefGoogle Scholar
  3. [3]
    D.J. Amarasekera. Conductive plastics for electrical and electronic applications [J]. Reinforced Plastics, 2005, 49(8): 38–41CrossRefGoogle Scholar
  4. [4]
    J.E. Mark. Some Novel Polymeric Nanocomposites[J]. Ace. Chem. Res., 2006, 39 (12): 881–888CrossRefGoogle Scholar
  5. [5]
    H.M. Ma, X.L. Gao. A three-dimensional Monte Carlo model for electrically conductive polymer matrix composites filled with curved fibers [J]. Polymer, 2008, 49(19): 4230–4238CrossRefGoogle Scholar
  6. [6]
    O.D. Neikov, S.S. Naboychenko, I.V. Murashova, et al. Handbook of Non-Ferrous Metal Powders — Technologies and Applications[M]. Elsevier, 2009: 331–367Google Scholar
  7. [7]
    E. Comini, G. Faglia, M. Ferroni, et al. Physical Vapor Deposition of Copper Oxide Nanowires[J]. Procedia Engineering, 2010,5: 1051–1054CrossRefGoogle Scholar
  8. [8]
    Y. Konishi, M. Motoyama, H. Matsushima, et al. Electrodeposition of Cu nanowire arrays with a template[J]. Journal of Electroanalytical Chemistry, 2003, 559: 149–153CrossRefGoogle Scholar
  9. [9]
    X.B. Cao, F. Yu, L.Y. Li, et al. Copper nanorod junctions templated by a novel polymer-surfactant aggregate[J]. Journal of Crystal Growth, 2003, 254(1–2): 164–168CrossRefGoogle Scholar
  10. [10]
    T. Ahmad, A. Ganguly, J. Ahmed, et al. Nanorods of transition metal oxalates: A versatile route to the oxide nanoparticles[J]. Arabian Journal of Chemistry, 2011, 4(2):125–134CrossRefGoogle Scholar
  11. [11]
    Z.G. Jia, L.H. Yue, YF. Zheng, et al. The convenient preparation of porous CuO via copper oxalate precursor[J]. Materials Research Bulletin, 2008, 43(8–9): 2434–2440CrossRefGoogle Scholar
  12. [12]
    X.J. Zhang, D.G Zhang, X.M. Ni, et al. Optical and electrochemical properties of nanosized CuO via thermal decomposition of copper oxalate[J]. Solid-State Electronics, 2008, 52(2): 245–248CrossRefGoogle Scholar
  13. [13]
    N. Jongen, P. Bowen, J. Lemaitre, et al. Precipitation of Self-Organized Copper Oxalate Polycrystalline Particles in the Presence of Hydroxypropylmethylcellulose (HPMC): Control of Morphology [J]. Journal of Colloid and Interface Science, 2000, 226(2): 189–198CrossRefGoogle Scholar
  14. [14]
    T. Ahmad, R. Chopra, R.V. Kandalam, et al. Nanorods of copper and nickel oxalates synthesized by the reverse micellar route [J]. Journal of Nanoscience and Nanotechnology, 2005, 5(11): 1840–1845CrossRefGoogle Scholar
  15. [15]
    M.Y. Li, W.S. Dong, C.L. Liu, et al. Ionic liquid-assisted synthesis of copper oxalate nanowires and their conversion to copper oxide nanowires[J]. Journal of Crystal Growth, 2008, 310(21): 4628–4634CrossRefGoogle Scholar
  16. [16]
    C.W. Bale, P. Chartrand, S.A. Degterov,et al. FactSage Thermochemical Software and Databases [J]. Calphad, 2002, 26(2): 189–228CrossRefGoogle Scholar
  17. [17]
    C.W. Bale, E. Bélisle, P. Chartrand, et al. FactSage Thermochemical Software and Databases — Recent Developments [J]. Calphad, 2009, 33(2): 295–311CrossRefGoogle Scholar
  18. [18]
    Y.Q. Fan, C.F. Zhang, J. Zhan, et al. Thermodynamic equilibrium calculation on preparation of copper oxalate precursor powder. Trans. Nonferrous Met. Soc. China, 2008, 18(2): 454–458CrossRefGoogle Scholar

Copyright information

© TMS (The Minerals, Metals & Materials Society) 2013

Authors and Affiliations

  • Youqi Fan
    • 1
  • Yongxiang Yang
    • 2
  • Yanping Xiao
    • 2
  • Zhuo Zhao
    • 1
  1. 1.School of Metallurgy and ResourceAnhui University of TechnologyAnhuiPR China
  2. 2.Department of Materials Science and EngineeringDelft University of TechnologyDelftThe Netherlands

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