Abstract
Ultrasonically bonded Al wire bonds on Al metallization pads are widely used in power semiconductors. The required long time reliability of the devices is highly dependent on the interfacial quality of Al wire and the bond pad. Reliability of wire bonds is commonly assessed by thermal and power cycling tests. Accelerated mechanical fatigue testing can be used as an alternative to these time consuming procedures. In the present study, lifetime of thick Al wedge bonds on Si substrates was investigated using a novel mechanical fatigue testing technique operating at high frequencies and elevated temperatures. The influence of microstructure, testing temperature and frequency on lifetime of Al wire bonds was investigated. Finite element analysis was applied to calculate the stress distribution at the interfacial region and to establish life time prediction curves. The results of mechanical isothermal fatigue curves were compared and correlated with thermal cycling data of Al wire bonds.
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© 2014 TMS (The Minerals, Metals & Materials Society)
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Khatibi, G., Lederer, M., Czerny, B., Kotas, A.B., Weiss, B. (2014). A New Approach for Evaluation of Fatigue Life of Al Wire Bonds in Power Electronics. In: Grandfield, J. (eds) Light Metals 2014. Springer, Cham. https://doi.org/10.1007/978-3-319-48144-9_47
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DOI: https://doi.org/10.1007/978-3-319-48144-9_47
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-48590-4
Online ISBN: 978-3-319-48144-9
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