Abstract
This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), buildup substrates for flip chip BGA (FCBGA), tape substrates for tape BGA (TBGA), coreless substrates, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant dielectrics, and substrate with embedded components (active dies and/or passives). Future trends of organic substrate development are covered in this chapter as well.
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Trademarks
aEASI and aS3 are trademarks of Advanced Semiconductor Engineering Inc.
ALIVH is a registered trademark of Matsushita Electric Industrial Co., Ltd.
B2iT is a trademark of Toshiba Corp.
DuPont and Vacrel are registered trademarks of E. I. du Pont de Nemours and Co.
ECP is a registered trademark of Austria Technologie und Systemtechnik A.G.
Microlam was a registered trademark of W. L. Gore and Associates, Inc.
MicroSiP is a trademark of Texas Instruments Inc.
HyperBGA is a registered trademark of i3 Electronics, Inc.
SESUB is a trademark of TDK Corporation
Virtex is a registered trademark of Xilinx, Inc.
Acknowledgment
I would like to recognize Dora Lee of ASE in Kaohsiung and Dr. Kay Essig of ASE Europe for their support in composing this chapter.
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Appelt, B.K. (2017). Advanced Substrates: A Materials and Processing Perspective. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_7
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DOI: https://doi.org/10.1007/978-3-319-45098-8_7
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