Abstract
To improve the integrity of densely stacked multilayers in microelectronic systems, e.g., Light Emitting Diodes (LED), and thereby overcome the currently experienced problems related to interface failure during manufacturing of such devices, accurate identification of interface properties is essential. The behavior of the interface is only measurable through kinematic information from adjacent materials.The goal of this research is to identify interface parameters by Integrated Digital Image Correlation (IDIC), in which experimental images of a deformation process are correlated by utilizing the mechanical response from finite element (FE) simulations. An interface is herein modeled by cohesive zone (CZ) elements exhibiting constitutive traction-separation laws. The versatility of FE simulations and the kinematic richness of the full-field measurements are thereby exploited.Comprising an elastic hinge system, a small-scale mechanical test-setup is designed from two 3-axes (XYZ) piezo stages, with which micrometer displacements and realistic interface loading conditions (shear, normal, and mixed-mode loading) can be applied to an LED specimen. This allows to, in a well-controlled manner, mechanically mimic interface delamination that is typically induced during fabrication steps by thermal expansion. This setup and the IDIC method are integrated to identify the CZ parameters of the critical interface of an LED specimen.
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References
Kolluri, M.: An in-situ experimental-numerical approach for interface delamination characterization. Ph.D.-thesis, Eindhoven University of Technology, 2011
Leclerc, H., Périé, J.N., Roux, S., Hild, F.: Integrated digital image correlation for the identification of mechanical properties. In: Computer Vision/Computer Graphics Collaboration Techniques. Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics), Lecture Notes in Computer Science, vol. 5496, pp. 161–171. Springer, Berlin (2009)
Réthoré, J., Muhibullah, Elguedj, T., Coret, M., Chaudet, P., Combescure, A.: Robust identification of elasto-plastic constitutive law parameters from digital images using 3D kinematics. Int. J. Solids Struct. 50 (1), 73–85 (2013)
Réthoré, J., Roux, S., Hild, F.: An extended and integrated digital image correlation technique applied to the analysis of fractured samples. Eur. J. Comput. Mech. 18, 285–306 (2009)
Roux, S., Hild, F.: Stress intensity factor measurements from digital image correlation: Post-processing and integrated approaches. Int. J. Fract. 140 (1–4), 141–157 (2006)
Ruybalid, A.P., Hoefnagels, J.P.M., van der Sluis, O., Geers, M.G.D.: Comparison of the identification performance of conventional FEM updating and integrated DIC. Int. J. Numer. Methods Eng. (2015)
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Ruybalid, A.P., Hoefnagels, J.P.M., van der Sluis, O., Geers, M.G.D. (2017). Full-Field Identification of Interfaces in Microelectronic Devices. In: Starman, L., Hay, J., Karanjgaokar, N. (eds) Micro and Nanomechanics, Volume 5. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-42228-2_2
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DOI: https://doi.org/10.1007/978-3-319-42228-2_2
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