Integrated Component Data Model Based on UML for Smart Components Lifecycle Management: A Conceptual Approach

  • Luiz Fernando C. S. Durão
  • Helge Eichhorn
  • Reiner Anderl
  • Klaus Schützer
  • Eduardo de Senzi ZanculEmail author
Conference paper
Part of the IFIP Advances in Information and Communication Technology book series (IFIPAICT, volume 467)


Cyber-Physical Production Systems (CPPS) and Smart Products are considered key features in the development of the fourth industrial revolution. To create a connected environment in manufacturing based on CPPS, components must be able to store and exchange data with machines, and with other components and assemblies along the entire production system. At the same time, Smart Product features require that products and their components be able to store and exchange data throughout their entire lifecycle. Therefore, the aim of this paper is to present a preliminary integrated component data model based on Unified Modeling Language (UML) for the implementation of CPPS and Smart Product features. The development of the data model is based on requirements gathered both from the literature review and from corporate interviews with potential users. The results are still preliminary since the research results are part of a bigger research effort under an international collaboration network.


Cyber-Physical production systems Product lifecycle management Data model Smart products 



The authors thank the Coordination for the Improvement of Higher Education Personnel (Capes), the Brazilian National Council for Scientific and Technological Development (CNPq), and the German Research Foundation (DFG) for supporting related projects. The authors also thank the companies involved for providing real case applications.


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Copyright information

© IFIP International Federation for Information Processing 2016

Authors and Affiliations

  • Luiz Fernando C. S. Durão
    • 1
  • Helge Eichhorn
    • 2
  • Reiner Anderl
    • 2
  • Klaus Schützer
    • 3
  • Eduardo de Senzi Zancul
    • 1
    Email author
  1. 1.University of São PauloSão PauloBrazil
  2. 2.Technische Universität DarmstadtDarmstadtGermany
  3. 3.Methodist University of PiracicabaPiracicabaBrazil

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