Overview of Carbon Nanotube Processing Methods

  • Franz KreuplEmail author


On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnects which can mitigate the observed reliability issues in advanced semiconductor interconnects [2].


Contact Resistance Chlorosulfonic Acid Chemical Vapor Deposition Reactor Vertical Interconnect Floating Catalyst Chemical Vapor Deposition 
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Copyright information

© Springer International Publishing Switzerland 2017

Authors and Affiliations

  1. 1.TUMMunichGermany

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