Abstract
In Chapters 1 and 2, we studied the device and digital circuit aspects of dual and single work function SNTs with the intention to minimize power dissipation. Both of these studies have determined that silicon nanowire technology is better suited for the future of VLSI in terms of circuit speed and power dissipation compared to dual-gated SOI or FiNFET technologies. These studies also included the weaknesses of SNTs such as increased layout area due to surrounding gate metal thickness, large source resistance caused by source contact extension, and limited ON current caused by fixed transistor geometry. In Chapters 1 and 2, SPICE level 6 models were used in circuit simulations. While these models had acceptable accuracy in producing speed and power dissipation figures for basic CMOS logic gates, more accurate intrinsic device modeling and parasitic RC extraction were required for simulating larger scale digital circuits, analog circuits, and Radio Frequency (RF) circuits. This need prompted us to explore more accurate SPICE models such as BSIMSOI for fully depleted Silicon-On-Insulator (SOI) devices to use in the circuit simulations. This chapter examines how the intrinsic and extrinsic BSIMSOI models were created for NMOS and PMOS SNTs.
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Bindal, A., Hamedi-Hagh, S. (2016). SPICE Modeling for Analog and Digital Applications. In: Silicon Nanowire Transistors. Springer, Cham. https://doi.org/10.1007/978-3-319-27177-4_3
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DOI: https://doi.org/10.1007/978-3-319-27177-4_3
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