Abstract
Laser welding of glass-to-metal electrical connectors is a common manufacturing method for creating a hermetically sealed device. The materials in these connectors, in particular the organic glass, are sensitive to thermal induced residual stress and localized heating. An analytical laser weld model is developed that provides simulation and analysis of both thermal and mechanical effects of the welding process. Experimental studies were conducted to measure the temperature at various locations on the connector. The laser weld is modeled using both surface and volumetric heating directed along the weld path to capture the thermal and mechanical response. The weld region is modeled using an elastic-plastic weld material model, which allows for compliance before welding and stiffening after the weld cools. Results from a finite element model of the glass-to-metal seal are presented and compared with experimental results. The residual compressive stress in the glass is reduced due to the welding process but hermeticity is maintained.
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Acknowledgements
Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000. The authors would like to acknowledge Derek Luu for his support of this project. Also, the authors would also like to thank Kurtis Ford and Russell Teeter for their advice and guidance.
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© 2016 The Society for Experimental Mechanics, Inc.
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Jamison, R.D., Gorman, P.H., Rodelas, J., MacCallum, D.O., Neidigk, M., Dempsey, J.F. (2016). Analysis of Laser Weld Induced Stress in a Hermetic Seal. In: Bossuyt, S., Schajer, G., Carpinteri, A. (eds) Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-21765-9_25
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DOI: https://doi.org/10.1007/978-3-319-21765-9_25
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-21764-2
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