Skip to main content

Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications

  • Conference paper
  • First Online:
Advanced Microsystems for Automotive Applications 2015

Abstract

The electrification of drive trains combined with special requirements of the automotive and heavy construction equipment applications drives the development of small, highly integrated and reliable power inverters. To minimize the volume and increase the reliability of the power switching devices a module consisting of SiC devices with double sided cooling capability has been developed. There are several benefits related to cooling the power devices on both sides. The major improvement is the ability to increase the power density, and thereby reduce the number of active switching devices required which in turn reduces costs. Other expected benefits of more efficient cooling are reductions in volume and mass per power ratio. Alternatively, improved reliability margins due to lower temperature swings during operation are can be expected. Removing the wire bonds on the top side of the devices is expected to improve the reliability regardless, since wire bonds are known to be one of the main limitations in power switching devices. In addition, it is possible to design the package with substantially lower inductance, which can allow faster switching of the devices. In this paper the design, simulations and fabrication process of a double sided SiC-based power module are presented.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Gustafsson T, Nord S, Andersson D, Brinkfeldt K, Hilpert F (2014) COSIVU—compact, smart and reliable drive unit for commercial electric vehicles. In: Proceedings of AMAA 2014, advanced microsystems for automotive applications 2014, lecture notes in mobility. Springer, pp 191–200

    Google Scholar 

  2. Otto A, Kaulfersch E, Brinkfeldt K, Neumaier K, Zschieschang O, Andersson D, Rzepka S (2014) Reliability of new SiC BJT power modules for fully electric vehicles. In: Proceedings of AMAA 2014, advanced microsystems for automotive applications 2014, lecture notes in mobility. Springer, pp 235–244

    Google Scholar 

  3. Weitzel CE, Palmour JW, Carter CH Jr, Moore K, Nordquist KJ et al (1996) Silicon carbide high-power devices. IEEE Trans Electron Dev 43(10):1732–1741

    Google Scholar 

  4. Cooper JA Jr, Agarwal A (2002) SiC power-switching devices—the second electronics revolution? Proc IEEE 90(6):956–968

    Article  Google Scholar 

  5. Chang H-R, Bu J, Kong G, Labayen R (2011) 300A 650 V 70 um thin IGBTs with double-sided cooling. In: Proceedings of the international symposium on power semiconductor devices and ICs, pp 320–323

    Google Scholar 

  6. Ning P, Liang Z, Wang F (2013) Double-sided cooling design for novel planar module. In: Conference proceedings—IEEE applied power electronics conference and exposition—APEC, pp 616–621

    Google Scholar 

  7. Zhang H, Ang SS, Mantooth HA, Krishnamurthy S (2013) A high temperature, double-sided cooling SiC power electronics module. In: 2013 IEEE energy conversion congress and exposition, ECCE 2013, pp 2877–2883

    Google Scholar 

  8. Hoene E, Ostmann A, Lai BT, Marczok C, Müsing A, Kolar JW (2013) Ultra-low-inductance power module for fast switching semiconductors. In: PCIM Europe conference proceedings, pp 198–205

    Google Scholar 

  9. Brinkfeldt K, Edwards M, Andersson D, Neumaier K, Zschieschang O et al (2015) Modeling and fabrication of a SiC-based power module with double sided cooling. In: 20th annual pan pacific microelectronics symposium 2015

    Google Scholar 

  10. Bai JG, Zhang ZZ, Calata JN, Lu G-Q (2006) Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material. IEEE Tran Compon Packag Technol 29(3):589–593

    Google Scholar 

  11. Schubert A, Walter H, Dudek R, Michel B, Lefranc G et al (2001) Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders. In: Proceedings of the international symposium and exhibition on advanced packaging materials processes, properties and interfaces, pp 129–134

    Google Scholar 

  12. Chidambaram NV (1991) A numerical and experimental study of temperature cycle wire bond failure. Paper presented at the proceedings—electronic components conference, pp 877–882

    Google Scholar 

  13. Ramminger S, Seliger N, Wachutka G (2000) Reliability model for al wire bonds subjected to heel crack failures. Microelectron Reliab 40(8–10):1521–1525

    Article  Google Scholar 

  14. Chen G, Sun X-U, Nie P, Mei Y-H, Lu G-Q, Chen X (2012) High-temperature creep behavior of low-temperature-sintered nano-silver paste films. J Electron Mater 41(4):782–790

    Google Scholar 

  15. Chen G, Zhang Z-S, Mei Y-H, Li X, Lu G-Q, Chen X (2013) Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. Microelectron Reliab 53(4):645–651

    Google Scholar 

  16. Li X, Chen G, Wang L, Mei Y-H, Chen X, Lu G-Q (2013) Creep properties of low-temperature sintered nano-silver lap shear joints. Mater Sci Eng A, 579:108–113

    Google Scholar 

  17. Dudek R, Döring R, Sommer P, Seiler B, Kreyssig K et al (2014) Combined experimental-and FE-studies on sinter-Ag behavior and effects on IGBT-module reliability. In: 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and micro-systems, EuroSimE 2014

    Google Scholar 

Download references

Acknowledgments

The Authors would like to acknowledge the European Commission for supporting these activities within the COSIVU project under grant agreement number 313980.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Klas Brinkfeldt .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2016 Springer International Publishing Switzerland

About this paper

Cite this paper

Brinkfeldt, K. et al. (2016). Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications. In: Schulze, T., Müller, B., Meyer, G. (eds) Advanced Microsystems for Automotive Applications 2015. Lecture Notes in Mobility. Springer, Cham. https://doi.org/10.1007/978-3-319-20855-8_13

Download citation

  • DOI: https://doi.org/10.1007/978-3-319-20855-8_13

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-20854-1

  • Online ISBN: 978-3-319-20855-8

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics