Abstract
The capabilities of many digital electronic devices are strongly linked to Moore’s law: processing speed, memory and functional capacity and even the number and size of pixels in digital cameras. All of these are improving at roughly exponential rates as well. This exponential improvement has dramatically enhanced the impact of digital electronics in nearly every segment of the semiconductor industry, and is a driving force of technological and social change in the late 20th and early 21st centuries. This chapter discusses the historical evolution of semiconductor industry from 2D CMOS based technologies to today’s three-dimensional (3D) integrated circuits using 3D vertical interconnects. Our main focus in this book is to explain the need and the development of tools and technologies that supports the utilization this emerging technology to improve the performance and manufacturability of high density Field Programmable Gate Arrays (FPGAs).
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Pangracious, V., Marrakchi, Z., Mehrez, H. (2015). An Overview of Three-Dimensional Integration and FPGAs. In: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture. Lecture Notes in Electrical Engineering, vol 350. Springer, Cham. https://doi.org/10.1007/978-3-319-19174-4_1
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DOI: https://doi.org/10.1007/978-3-319-19174-4_1
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