New Trends in TSV

Chapter
Part of the Analog Circuits and Signal Processing book series (ACSP)

Abstract

In this chapter, several new directions are discussed for through silicon via (TSV) fabrication and use in design. Performance comparison between air-Gap gap-based coaxial TSV and conventional circular TSV is presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV. High-performance 3D TSV interconnects are important for reliability. Choice of the filler material is also a critical issue as thermal incompatibility, electromigration and, high resistivities are still a bottleneck. In this book, SW-CNT bundles are investigated as a prospective filler material for TSV compared to conventional filler materials like Cu, W, and polysilicon. It is found that SW-CNT bundles exhibit unique electrical, thermal, and mechanical characteristics that can be used to fabricate better TSV interconnects.

Moreover, in this chapter, TSV-based adiabatic logic based on the adiabatic switching principle is presented and analyzed. Adiabatic logic is a design technique for minimizing the energy dissipation. Its major limitation is the requirement for passive components, which cannot be efficiently integrated into current generation integrated circuits (ICs). TSV-based 3D heterogeneous integration may enable efficient integration of these passive elements, which were not practically feasible in the past due to technology limitations.

Keywords

Trends Air gap Conventional Circular Coaxial SW-CNT Fan Adiabatic Pulse Converter CMOS Scattering Quantum Magnetic Kinetic 

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Copyright information

© Springer International Publishing Switzerland 2015

Authors and Affiliations

  1. 1.Mentor GraphicsHeliopolisEgypt
  2. 2.The American University (New Cairo) and Zewail City of Science and Technology (6th of October City)New CairoEgypt

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