Abstract
Exposed to mechanical stress, semiconductor materials may phase transform, resulting in changes of crystallographic structure and material properties, rather than deform by plastic flow. As a consequence, prediction of the state and distribution of strain in semiconductors has become crucial for the evaluation of performance and reliability of structures made of these materials. Indentation-induced phase transformation processes were studied by in situ Raman imaging of the deformed contact region of silicon, employing a Raman spectroscopy-enhanced instrumented indentation technique (IIT). This is, to our knowledge, the first sequence of Raman images documenting the evolution of the strain fields and combined changes in the phase distributions of a material under contact load.
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- 1.
Uncertainties represent manufacturer specifications.
- 2.
Uncertainties represent intrinsic measurement errors and mounting errors.
- 3.
The areas colored in black in the frequency plots for peaks 4 and 5 indicate that no signal for the particular peak was collected at these locations.
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Gerbig, Y.B., Michaels, C.A., Cook, R.F. (2015). Raman Spectroscopy-Enhanced IIT: In Situ Analysis of Mechanically Stressed Polycrystalline Si Thin Films. In: Sottos, N., Rowlands, R., Dannemann, K. (eds) Experimental and Applied Mechanics, Volume 6. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-06989-0_26
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