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Introduction

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Debugging Systems-on-Chip

Part of the book series: Embedded Systems ((EMSY))

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Abstract

We start this chapter in Sect. 1.2 by reviewing the trends, challenges, and methodologies used in the implementation, verification, and validation of SOCs. We describe a generic and commonly-used post-silicon debug process in Sect. 1.3, which helps debug engineers with the localization of the root cause of problems that occur post-silicon. In Sect. 1.4, we show however that this generic process has requirements that cannot easily be met post-silicon. We outline our proposed solution and the organization of this book in Sect. 1.5. In Sect. 1.6 we provide an overview of the contributions of this book with respect to the state of the art in post-silicon debug. We conclude this chapter with a summary in Sect. 1.7.

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Notes

  1. 1.

    The time-to-market is the time from the first concept of a new product to its market release.

  2. 2.

    A die is a single, unpackaged piece of silicon containing integrated circuits.

  3. 3.

    Figure 1.7 was obtained by counting the number of source code lines in the source code distributions of the Linux kernel, available at http://www.kernel.org, using the program cloc [7].

  4. 4.

    A silicon (re)spin refers to a(nother) pass through (part of) the design process and the manufacturing process to create a new silicon implementation (based on a new design).

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Authors and Affiliations

  1. NXP Semiconductors, Eindhoven, The Netherlands

    Bart Vermeulen

  2. Faculty of Electrical Engineering, Eindhoven University of Technology, Eindhoven, The Netherlands

    Kees Goossens

Authors
  1. Bart Vermeulen
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  2. Kees Goossens
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Corresponding author

Correspondence to Bart Vermeulen .

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© 2014 Springer International Publishing Switzerland

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Vermeulen, B., Goossens, K. (2014). Introduction. In: Debugging Systems-on-Chip. Embedded Systems. Springer, Cham. https://doi.org/10.1007/978-3-319-06242-6_1

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  • DOI: https://doi.org/10.1007/978-3-319-06242-6_1

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-06241-9

  • Online ISBN: 978-3-319-06242-6

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