The Effect of Annealing on the Microstructure and Scratch Behavior of Copper Deposited Film

Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 293)


In this study, copper film with thickness 5 μm was deposited by electron beam evaporation on slightly oxidized silicon substrates. Ti and Al metals were used as adhesion or barrier layers. The effect of annealing on the microstructure, resistivity and scratch behavior of Cu film was investigated using a scratch indenter of radius of 2.5 μm. Results revealed that the resistivity decreases, but scratch resistance increases after annealing. Compared to as-deposited film, the annealed one exhibited not only higher friction coefficient, but also lower loading of the first fracture, due to grain growth.


Cu film Resistivity Scratch Annealing 


  1. 1.
    Kumar, N., & Nelson, B. H. (1990). Multi-chip module interconnect and packaging technology for the 90’s. Proceedings of Asm International’s 3rd Electronic Materials and Processing Congress (pp. 99–109).Google Scholar
  2. 2.
    Kim, H., Koseki, F., Ohta, T., Kojima, Y., Sato, H., & Shimogakia, Y. (2005). Cu wettability and diffusion barrier property of Ru thin film for Cu metallization. Journal of the Electrochemical Society, 152, 594–600.Google Scholar
  3. 3.
    Bull, S. J., & Berasetegui, E. G. (2006). An overview of the potential of quantitative coating adhesion measurement by scratch testing. Tribology International, 39, 99–114.CrossRefGoogle Scholar
  4. 4.
    Shen, W., Sun, J., Liu, Z., Mao, W., Nordstrom, J. D., Ziemer, P. D., et al. (2004). Methods for study of mechanical and tribological properties of hard and soft coating with a nanoindenter. Journal of Coatings Technology and Research, 1(2), 117–125.CrossRefGoogle Scholar
  5. 5.
    Joslin, D. L., & Oliver, W. C. (1990). A new method for analyzing data from continuous depth-sensing microindentation tests. Journal of Materials Research, 5, 123–126.CrossRefGoogle Scholar
  6. 6.
    Hainsworh, S. V., Chandler, H. W., & Page, T. F. (1996). Analysis of nanoindentation load-displacement loading curves. Journal of Materials Research, 11, 1987–1995.CrossRefGoogle Scholar

Copyright information

© Springer International Publishing Switzerland 2014

Authors and Affiliations

  1. 1.Department of Electrical EngineeringCheng Shiu UniversityKaohsiungTaiwan, Republic of China
  2. 2.Department of Mechanical and Automation EngineeringI-Sou UniversityKaohsiungTaiwan, Republic of China

Personalised recommendations