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The Effect of Annealing on the Microstructure and Scratch Behavior of Copper Deposited Film

Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 293)

Abstract

In this study, copper film with thickness 5 μm was deposited by electron beam evaporation on slightly oxidized silicon substrates. Ti and Al metals were used as adhesion or barrier layers. The effect of annealing on the microstructure, resistivity and scratch behavior of Cu film was investigated using a scratch indenter of radius of 2.5 μm. Results revealed that the resistivity decreases, but scratch resistance increases after annealing. Compared to as-deposited film, the annealed one exhibited not only higher friction coefficient, but also lower loading of the first fracture, due to grain growth.

Keywords

Cu film Resistivity Scratch Annealing 

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Copyright information

© Springer International Publishing Switzerland 2014

Authors and Affiliations

  1. 1.Department of Electrical EngineeringCheng Shiu UniversityKaohsiungTaiwan, Republic of China
  2. 2.Department of Mechanical and Automation EngineeringI-Sou UniversityKaohsiungTaiwan, Republic of China

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