The Effect of Annealing on the Microstructure and Scratch Behavior of Copper Deposited Film
In this study, copper film with thickness 5 μm was deposited by electron beam evaporation on slightly oxidized silicon substrates. Ti and Al metals were used as adhesion or barrier layers. The effect of annealing on the microstructure, resistivity and scratch behavior of Cu film was investigated using a scratch indenter of radius of 2.5 μm. Results revealed that the resistivity decreases, but scratch resistance increases after annealing. Compared to as-deposited film, the annealed one exhibited not only higher friction coefficient, but also lower loading of the first fracture, due to grain growth.
KeywordsCu film Resistivity Scratch Annealing
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