The Fatigue Life Analysis of the VCSEL with Sn/Pb and Sn/Ag/Cu Solder

  • Bo-Rong Qiu
  • Cheng-Han Lin
  • Ah-Der Lin
  • Chao-Ming Hsu
Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 293)

Abstract

The Coffin-Manson equations of Sn/Ag/Cu and Sn/Pb solder joints are presented in this paper. The experimental results of CSP thermal cycle fatigue test and ball shear test are used to formulate Coffin-Manson equations. The maximum amplitude of equivalent plastic shear strain corresponding to these two experiments are employed. The MARC finite element package is used to calculate the plastic shear strain. Different published fatigue experiment results have been used to show the accuracy and the feasibility of these proposed equations. The 3-D finite element models of the VCSEL assembly are employed to simulate the thermal cycling fatigue. Results indicate that the fatigue life of solder predicted by using the proposed equations have good agreement with those measured from experimental tests.

Keywords

Coffin-Manson VCSEL Equivalent plastic shear strain 

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Copyright information

© Springer International Publishing Switzerland 2014

Authors and Affiliations

  • Bo-Rong Qiu
    • 1
  • Cheng-Han Lin
    • 2
  • Ah-Der Lin
    • 2
  • Chao-Ming Hsu
    • 2
  1. 1.Department of Mechanical EngineeringNational Kaohsiung University of Applied ScienceKaohsiungTaiwan, Republic of China
  2. 2.Department of Mechanical EngineeringCheng-Shiu UniversityKaohsiungTaiwan, Republic of China

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