Abstract
The trend towards high level integration of the system functional blocks on-chip is eliminating the barrier between the components and systems. System-on-chip (SoC) and system-in-package (SiP) designs now often combine a variety of analog and digital circuit blocks that can directly interface with system ports and therefore may require system level ESD protection capability.
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© 2014 Springer International Publishing Switzerland
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Vashchenko, V., Scholz, M. (2014). IC and System ESD Co-design. In: System Level ESD Protection. Springer, Cham. https://doi.org/10.1007/978-3-319-03221-4_5
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DOI: https://doi.org/10.1007/978-3-319-03221-4_5
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Publisher Name: Springer, Cham
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Online ISBN: 978-3-319-03221-4
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